IFETC-3’s Technical Program covers a wide range of cutting-edge developments in printed and flexible electronics. IFETC, started in Ottawa, Canada (2018) is a new EDS-lead international conference, focusing upon printed and flexible hybrid and non-hybrid materials, devices and systems. It will rotate between the Americas, Asia and Europe, heading to Shanghai PRC in 2022. IFETC aims to bring together a wide variety of stakeholders, from chemists, materials scientists, physicists, to mechanical and electrical engineers, the fabrication and manufacturing communities, as well as end-users, e.g. packaging and medical communities.